November 01 (Wednesday)
[특별세션] 금속 3D프린팅
Poster,
3층 로비,
14:40~15:30
  • Chair :
  •  하태호(기계연)
We16C-2
14:40~15:30

Additive manufacturing with In-Bi-Sn low melting alloy on various substrates

구본진, 당현우, 양용석(한국전자통신연구원)
Additively manufactured 2D patterning and 3D structure were accomplished through the use of Indium based low melting alloy, known as Field’s metal, via liquid metal direct writing 3D printing technology. The Field’s metal has the eutectic composition of 51In-31.5Bi-16.5Sn characterized with its low melting temperature of 62˚C, decent ductility for shape deformation, and good adhesion to substrates. The alloy was melted and printed through the nozzle diameter of 300μm on various types of substrates including fused deposition model (FDM) based substrate. The printing operated at nozzle temperature of 70˚C and therefore no thermal damage was applied on polymer based substrates such as PI and PES.
Keywords : Field's metal, In-Bi-Sn eutectic alloy, 공정금속, liquid metal(액체금속), 3D프린팅
Paper : We16C-2.pdf

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