In this study, we developed a multi-material 3D printing system for to print electronic device. The printing materials are included Ag paste, low melting point metal, and polylactic acid. The multi-material 3D printing system can simplify the PCB manufacturing process and product small amount of PCB for testing with low cost. In order to verify the printability of the system, the line width of the printed Ag paste and low melting point metal were measured. In addition, the resistances of the printed Ag paste lines were also measured. The result show that the line width of the Ag paste was under 300um and low melting point metal was under 200um. The resistance of the printed Ag paste lines were under 0.7Ω. Take to all results, we showed the possibility of our multi-material 3D printing system for PCB fabrication but the printing stability should be improved.