Fabricating micro electronic devices need to integrate the devices onto various substrates. However, processing temperature and electrical or thermal resistance may increase if liquid adhesive is used when placing the micro electronic devices onto the substrate.This presentation suggests an effective method of transfer printing that does not use the liquid adhesive at the interlayer of the devices and the substrates. Controlled adhesion force of an elastomeric stamp by varying bending radius of the stamp results in picking up or printing of micro semiconductor plates. The capability of switching adhesion enables transfer printing the micro semiconductor plates onto curvilinear, or flexible substrates without the liquid adhesive. Several theoretical or experimental studies support the mechanism of the suggested method.