A novel fabrication method for highly flexible Cu random network transparent conductor has been developed by random nanocrack generation and subsequent Cu nanoparticle ink filling, transfer, and oxidation-free laser sintering without the aid of conventional photolithography or vacuum metal deposition steps. Use of random crack on a silicon as a transfer printing template enables large area, high resolution network patterning. In addition, laser sintering process allows low temperature, fast processing time, and oxidation suppression of Cu nanoparticle under ambient atmosphere. Moreover, the template-assisted Cu metal network fabrication method minimizes waste of Cu nanoparticle as compared with other methods. A simple touch screen using Cu metal network-based transparent conductors also demonstrated.