The newly developed silicon rubber sockets become an essential element in the semiconductor product development and its testing environment. Its higher performance on testing leads to the replacement of pogo pin type test sockets. The evolution of integrated circuit component sockets toward more densely packed contacts in a very smaller footprint has become a higher standard for the test socket used in the final device test; owing to its reusability, it is suitable for a reliable test. In addition, the electrical performance of the rubber sockets much higher compared with the conventional type pogo pin and solder ball sockets. The high speed testing characteristics has brought several mechanical challenges for the rubber sockets. The mechanical damages are usually occur at interfaces during the device under test. In the present study, the contact behavior of the rubber socket and composed of power particles interconnect interface was evaluated under mechanical stress using finite element modelling. Other mechanical damages such as formation of burrs, interface wear and indentation marks has addressed and compared with damages of the pogo pin socket. The simulation results revealed that the mechanical stresses of the rubber socket are less than the pogo pin type sockets. The stress produced by the mechanical force device under test dispersed bitterly for the rubber type test sockets due to their fine pitch size and short length pins.