For predicting the vibration and acoustic noise of the printed circuit board assembly(PCBA) products during operation, a finite element model of a solid state drive(SSD) coupled with the multi-layer ceramic capacitors(MLCCs) which excite the substrate is required. In this study, the finite element model of the SSD was constructed considering multi-layer printed circuit board(PCB) and major components, devices, and solder balls. Afterwards, the model was verified through the modal assurance criterion(MAC) and the natural frequencies. Finally the voltage signal was inputted to the bulk MLCCs according to the operation state of the SSD, and the harmonic and acoustic simulation were performed.