Generally, electronic devices generate heat from heat sources such as the center processing unit(CPU) during operation. Heat is a major cause of reduced device performance and shortened device life. Because electronic devices generally require thermal management to minimize temperature of their components, several air fans and heat sinks or water-cooled coolers are usually employed. However, the fans cause noise and vibration, and existing heat sinks and water-cooled coolers require complex structural design and large space in the system. In this study, we designed a flow control structure for heat dissipation in a digital video recorder (DVR). Suggested structure consists of simple and slim metal barriers. Their size and locations were determined via parametric studies to remove heat efficiently in the device by inducing effective air flows from the heat sources to discharge fan. To verify the design result, we carried out a three-dimensional time dependent numerical analysis using a commercial fluid dynamics analysis package FlowVision.