Military Equipment is equipped with electronic Device in the console cabinet to ensure safety in various environments such as vibration and shock. and Generally, it is common practice to fabricate multiple samples and test them for reliability. Major disadvantages of this development process are waste of time and excessive Failure Expense. To overcome these disadvantages, we use finite element analysis method.
In this paper, We studied Structural Safety of the SSPA(Solid State Power Amplifier) Device which is installed in 19“ standard rack with finite element analysis. To save Pre-processing and Post-processing time, the ANSYS WORKBENCH was employed to simulate SSPA. Simplified structural analysis was performed to verify the simulation FE model. Vibration analysis is performed according to the MIL-STD-167-1A and Shock analysis is performed to investigate the effect of a 20g for 2ms load applied in three axes based on the procedures given in MIL-STD-810F