3D printing technique is currently one of the most interesting items in the world. These techniques can be used various application fields, such as medical and dental field, electronics, aerospace, automotive, design, architecture, and so on. In particular, we are interested in molded interconnected device (MID) and 3D printed electronic circuits (PCB).
Therefore, we studied various composite materials, which are glass powder, carbon powder, carbon nanotube (CNT), and cellulose nanocrystal (CNC), for improving thermal, mechanical, and electrical properties of thermoplastic substrates. We fabricated thermoplastic filaments using a mini-extruder machine and successfully 3D printed substrate for electronic circuits via fused deposition modelling (FDM) printer. Many 3D printed samples were characterized thermal, mechanical, and electrical properties by thermal mechanical analyzer (TMA), micro-universal testing machine, LCR meter. Surface morphology and distribution of composite materials were measured by scanning electron microscope (SEM) and X-ray microscopy (XRM).

This work was supported by the National Research Council of Science & Technology (NST) grant by the Korea government (MSIP) (No. CRC-15-03-KIMM).