In this work, we suggest a compact liquid cooling system based on a copper foam heat sink for thermal management of high power IGBT modules. Coolant path was designed for decreasing the pressure drop and effectively transferring the heat from heat sources. Cooling performance of the system was numerically evaluated with a commercial CFD software. We assumed a high power IGBT module for the condition of heat dissipation. We show that our liquid cooling system has a lower junction to coolant thermal resistance than previous cooling systems. Especially, low mass flow rate and pressure drop of the cooling loop was measured due to minimized coolant path and high porosity of the Cu foam. Numerical data was experimentally demonstrated with a given mass flow rate range. This study will be applied to high powered electronic applications where thermal management of multiple heat sources was needed.