Shape memory polymer composite (SMPC) hinge has been designed, fabricated, and tested successfully in our previous works. Since the SMPC hinge is developed for space applications, shape recoverability of the SMPC hinge needs to be examined in a low temperature environment. A SMPC hinge was consisted of 4 plies of carbon epoxy fabric and a poly-urethane based shape memory polymer. It was cured at 75oC, which made epoxy in B-stage. Two heating elements were attached on the SMPC hinge to supply enough energy to activate the unfolding process. The selection of heating elements needed an energy balance calculation. The deploying test of a SMPC hinge was performed at -10oC. This paper describes detailed procedure of the preparation of specimens and experimental setup. The result show that SMPC hinge is able to deploy in low temperature environment, however, it is not full recovery. So, more research needs to be conducted to improve the performance of SMPC hinge at low temperature.