Dear Colleagues:
Considering your outstanding contributions and achievements, we cordially invite you to participate in the 14th U.S. National Congress on Computational Mechanics (USNCCM14) by presenting your recent work in our mini-symposium entitled Computational Modeling of Multi-Functional Materials. The Congress will be held at the Palais des Congrès de Montréal, Québec, Canada, July 17-20, 2017 (website http://14.usnccm.org/). The mini-symposium on “Computational Modeling of Multi-Functional Materials” will focus on recent advances and progress in the development of computational methods for multi-scale, multi-functional systems in diverse fields including mechanical engineering, material science, biology, etc. The traditional approach to materials design has focused on a single and specific function. Recently, however, there has been a significant interest in the development of materials and systems which exhibit multifunctional behavior. For example, traditional materials that provide high stiffness and strength can now be designed for other properties such as energy absorption, self-healing, and even shape morphing. Some of the topics of interest for this symposium are: - Multiphysics and multiscale analysis of soft and hard multifunctional materials
- Computational materials design for multifunctional behavior
- Fundamentals of interfaces in multifunctional materials
- Quantum, atomistic and continuum approaches for heterogeneous multifunctional materials
- Multifunctional nanoparticles
- Bio-inspired multifunctional materials
- Stimuli-responsive materials
- Metamaterials
- Multi-functional composite materials
- Tailoring techniques for multi-functional materials
- Multi-functional materials for biological applications
- Other topics as appropriate We kindly request you to submit your abstract by February 28, 2017 via USNCCM14 conference website (http://14.usnccm.org/abstract_instructions). For planning purposes, we kindly request you to notify us if you are planning to submit an abstract and participate in the mini-symposium. Please do not hesitate to contact to contact us if you have any questions. We look forward to see you at Montreal.
Sincerely,
Jae Hyun Park
Department of Aerospace and Software Engineering,
Gyeongsnag National University, SOUTH KOREA
E-mail: parkj@gnu.ac.kr Narayana Aluru
Department of Mechanical Science and Engineering,
University of Illinois at Urbana-Champaign
E-mail: aluru@illinois.edu Sang-Bok Lee
Composite Research Divsion,
Korea Institute of Materials Science (KIMS)
E-mail: leesb@kims.re.kr Mini-Symposium Co-Organizers |
